Chip Scale Package (CSP) rework on mobile phone board

Name: Chip Scale Package (CSP) rework on mobile phone board
Uploaded: 2014-01-28T09:28:38+00:00
Duration: 4 min 21 s
Channel: fineplacer
Description: Rework of a 3x3 mm µBGA component on a mobile phone board. The machine used in this video is here: <br />http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

fineplacer

Rework of a 3x3 mm µBGA component on a mobile phone board. The machine used in this video is here:   http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

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